Laser cutting machine

  • Laser cutting machine
  • Laser cutting machine
Laser cutting machineLaser cutting machine

Laser cutting machine

  • Laser: Optical fiber
  • Working speed: 200mm/s
  • Power: 20W
  • Product description: Laser cutting machine
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Main purpose of equipment: mono crystal line and poly crystal line silicon solar cell dicing process.

1. Main technical specification

1.1.Lasers: Fiber Laser

1.2. Laser wavelength: 1064nm

1.3, Laser power: ≤20 W

1.4, Pulse frequency: 30kH ~ 60kH

1.5, Scribing speed: ≤240 mm / s

1.6 Pprocessing format: 200 × 200mm

1.7 Repeatability: ± 20μm

1.8 Power supply: 220V / 50Hz / 1.5kVA

1.9 Friendly operation system.

 

4.  Complete machine configuration

2.1 Laser: Domestic fiber laser (air-cooled)

2.2 Power control cabinet

2.2.1  Laser power supply

2.2.2  Main power supply and protection system

2.2.3  Table drive system

2.2.4  Computers and monitors (IPC chassis)

2.2.5  Special control software ( English Version ).

2.3  Work table

2.3.1  Servo motor drive

2.3.2  Ball screw / linear guide / Couplings

2.3.3  Vacuum adsorption system (foot control) (automatic adsorption).

2.3.4  Dust extraction system.